Sunnyvale, Calif.—Spansion LLC, the Flash memory venture of AMD and Fujitsu Limited today announced it is shipping Package-on-Package (PoP) Flash memory samples to customers that will enable them to ...

Geneva – STMicroelectronics (NYSE: STM), a leading supplier of non-volatile memory (NVM) for mobile phones, today announced the availability of memory solutions using Package-on-Package (PoP) ...

Your next smartphone purchase might come with a new type of memory, depending on the model and when you buy it. That is because Samsung has begun mass producing what it claims is the industry's ...

Avid readers of Tom’s Hardware have read a lot about the upcoming HBM4 and GDDR6 memory technologies, but as neither is used on mass production devices, few of us get to see actual HBM4 and GDDR6 ...

Micron is reportedly developing a new memory architecture based on vertically stacked GDDR, targeting a space between traditional GDDR and high-bandwidth memory (HBM).

Intel has released a new video showing off its advanced packaging technologies. The goal of the video seems to be to attract customers to its Intel Foundry Services (IFS) business by letting the world ...

Intel’s upcoming Meteor Lake processors will be the company’s first chips manufactured using a new Intel 4 process, which the company says will bring improvements in performance and efficiency.

Apple is working with Samsung to change how RAM is packaged for the iPhone, with the aim of widening the bandwidth to help in AI tasks. While most smartphones have their RAM on the same package as the ...

An advanced packaging technology has been developed that allows the mechanical stacking of chip-scale memory devices using a fine-pitch ball grid array (FBGA) interface. Significantly reducing ...

Fujitsu Ltd. has developed a high-density memory package for use in mobile phones with 20 percent more capacity than its existing memory packages, the company announced last week. The extra capacity ...

In the world of solid-state memory fabs, bits per mm 2 rule. In the memory packaging market, mm 2 of silicon per a given package thickness is the defining feature. Both the memory architecture of the ...