Geneva – STMicroelectronics (NYSE: STM), a leading supplier of non-volatile memory (NVM) for mobile phones, today announced the availability of memory solutions using Package-on-Package (PoP) ...

Your next smartphone purchase might come with a new type of memory, depending on the model and when you buy it. That is because Samsung has begun mass producing what it claims is the industry's ...

Intel has released a new video showing off its advanced packaging technologies. The goal of the video seems to be to attract customers to its Intel Foundry Services (IFS) business by letting the world ...

Micron is reportedly developing a new memory architecture based on vertically stacked GDDR, targeting a space between traditional GDDR and high-bandwidth memory (HBM).

Intel’s upcoming Meteor Lake processors will be the company’s first chips manufactured using a new Intel 4 process, which the company says will bring improvements in performance and efficiency.

Apple is working with Samsung to change how RAM is packaged for the iPhone, with the aim of widening the bandwidth to help in AI tasks. While most smartphones have their RAM on the same package as the ...

Previously, I have addressed the component packaging problems found in FPGAs and perhaps given the impression that other packages were OK. However, after attending Memcon in Santa Clara in November, I ...

An advanced packaging technology has been developed that allows the mechanical stacking of chip-scale memory devices using a fine-pitch ball grid array (FBGA) interface. Significantly reducing ...

Micron Technology, Inc. has announced the shipment of qualification samples for the world’s first 1γ node-based low-power double data rate 5X (LPDDR5X) memory, aimed at enhancing AI applications in ...

Samsung is already talking about being in the early development of totally next-gen DDR6 memory, where during a recent seminar in Suwon, South Korea. During the seminar, Younggwan Ko, Samsung's Vice ...

In the world of solid-state memory fabs, bits per mm 2 rule. In the memory packaging market, mm 2 of silicon per a given package thickness is the defining feature. Both the memory architecture of the ...

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